The thermal interface material is filled between chip and shield, between SOC and copper foil, between motherboard and charging IC gap, etc., to complete the heat transfer between the heat-generating part and the heat-dissipating part, and also play the role of insulation, shock absorption and sealing. and so on.
Graphite film can be used to eliminate local hot spots and improve the temperature uniformity of mobile phone screen and back shell. After the high-power graphite film is stacked into a module, some scenes are consistent with the thermal conductivity of the heat pipe and VC, with low cost and good flexibility.