HS series thermal pads have good elasticity, compressibility, flexibility, insulation, and natural tackiness on the surface, which can fill the gaps, complete the heat transfer between heat-generating parts and heat-dissipating parts, and also have the effect of insulation, shock absorption and sealing.
Thermal conductivity:1.0 W/m·k ~ 5.0 W/m·k ; extremely small deformation force protects electrical components more effectively. Highly viscous surface reduces contact thermal resistance. thickness range is 0.15mm~15.0mm ; size can be cut according to customer needs.
Handheld terminals, computers, power modules, high-speed large-storage drives, flat-panel displays, network communications products, power conversion equipment, LEDs, automotive electronics, medical equipment, etc.
| Test Items | Units | Values | Test Method |
Thermal Conductivity | W/m·K | 1.0~5.0 | ASTM D5470 |
Thickness | mm | 0.15~15.0 | ASTM D374 |
Density | g/cm3 | 1.5~3.2 | ASTM D792 |
Hardness | Shore00 | 15~75 | ASTM D2240 |
Tensile Strength | MPa | ≥0.15 | ASTM D412 |
Breakdown Voltage | kV/mm | ≥8 | ASTM D149 |
Continuous Use Temp | ℃ | -40～200 | EN344 |
Flame Rating | -- | V-0 | UL 94 |
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