Low volatile thermal pad has the characteristics of low volatility, also have good elasticity, compressibility, flexibility, insulation, and natural tackiness on the surface, which can fill the gaps, complete the heat transfer between heat-generating parts and heat-dissipating parts, and also have the effect of insulation, shock absorption and sealing.
High insulation, high compressibility, natural surface viscosity, ultra-thin;
Smartphone, PC, server, NB, PAD, network communication equipment, smart wearable device products, etc.
Test Items | Units | Values | Test Method |
Thermal Conductivity | W/m·K | 1.0~5.0 | ASTM D5470 |
Thickness | mm | 0.15~15.0 | ASTM D374 |
Density | g/cm3 | 1.5~3.2 | ASTM D792 |
Hardness | Shore00 | 15~75 | ASTM D2240 |
Tensile Strength | MPa | ≥0.15 | ASTM D412 |
Breakdown Voltage | kV/mm | ≥8 | ASTM D149 |
Continuous Use Temp | ℃ | -40~200 | EN344 |
D3-D12 | ppm | ≤300 | -- |
Flame Rating | -- | V-0 | UL 94 |
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