HM series low dielectric constant thermal pad has low dielectric constant and no effect on antenna signal transmission. It can be used for thermal management of 5G smartphones, 5G CPE routers, electronic labels, antennas and other signal transmission components in the Internet of Things, AI, 5G and other fields.
Thermal conductivity is 3.0W/(m·K)~5.0W/(m·K), the dielectric constant is 3.6, and the dielectric loss is low. The size and specification can be cut according to the needs of customers.
Thermal management of 5G smartphones, 5G CPE routers, electronic tags, antennas and other signal transmission components in the Internet of Things, AI, 5G and other fields.
| Test Items | Units | Values | Test Method |
Color | -- | 白色 | Visual |
Thickness | mm | 1.0~3.0 | ASTM D374 |
Density | g/cm3 | 1.4-1.6 | ASTM D792 |
Hardness | Shore 00 | 50~75 | ASTM D2240 |
Breakdown Voltage | kV/mm | ≥7 | ASTM D149 |
Volume Impedance | Ω·cm | ≥1.0×1012 | ASTM D257 |
Dielectric Constant | 0-15GHz | 3.6 | ASTM D150 |
Continuous Use Temp | ℃ | -40~150 | -- |
| Thermal Conductivity | W/m·K | 3.0/5.0/7.0 | ASTM D54701 |
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