Graphene fiber thermal pad uses silicone as the substrate, filled with high thermal conductivity graphene, carbon fiber, carbon nanotubes and other carbon materials and arranged neatly in the thermal direction (thickness), to obtain a thermal pad with high thermal conductivity and low filling ratio.
Thermal conductivity:10.0W/m·k~100W/m·k, thickness range is ≥0.3mm; size can be cut according to customer needs
Communication base stations, servers, data centers, high- speed network communication products, 5G smartphones
Test Items | Units | Values | Test Method |
Thermal Conductivity | W/m·K | 10.0~100.0 | ASTM D5470 |
Thickness | mm | ≥0.3 | ASTM D374 |
Density | g/cm3 | 1.5~2.8 | ASTM D792 |
Hardness | Shore00 | 40~75 | ASTM D2240 |
Tensile Strength | MPa | ≥0.12 | ASTM D412 |
Continuous Use Temp | ℃ | -40~150 | EN344 |
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