Graphene Fiber Thermal Pad
Product Description
Performance and Features
Typical Applications
Product Characteristics

Graphene fiber thermal pad uses silicone as the substrate, filled with high thermal conductivity graphene, carbon fiber, carbon nanotubes and other carbon materials and arranged neatly in the thermal direction (thickness), to obtain a thermal pad with high thermal conductivity and low filling ratio.

Thermal conductivity:10.0W/m·k~100W/m·k, thickness range is ≥0.3mm; size can be cut according to customer needs

Communication base stations, servers, data centers, high- speed network communication products, 5G smartphones

Test ItemsUnitsValuesTest Method

Thermal Conductivity

W/m·K10.0~100.0ASTM D5470

Thickness

mm

0.3

ASTM   D374

Density

g/cm31.5~2.8ASTM   D792

Hardness

Shore00 40~75ASTM   D2240

Tensile Strength

MPa≥0.12ASTM   D412
Continuous Use Temp-40~150EN344

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