The matrix of the thermal insulation pad is polydimethyl vinyl siloxane, prepared by adding thermal insulating hollow microbeads,has the characteristics of sound insulation, heat insulation and low thermal conductivity. It is an excellent material for various thermal insulation, thermal insulation and sound insulation products. The insulating properties of the filled microspheres can also be used to protect the product from thermal shock caused by alternating between hot and cold conditions.
Low thermal conductivity, flexibility, high insulation, high compressibility, natural surface tack, ultra-thin
Smartphones, tablet computers, wearable devices, network communication equipment, power supply devices, etc.;
Test Items | Units | Values | Test Method |
Thickness | mm | ≥0.5 | ASTM D374 |
Density | g/cm3 | 0.6±0.2 | ASTM D792 |
Hardness | Shore 00 | 60~85 | ASTM D2240 |
Breakdown Voltage | kV/mm | ≥7 | ASTM D149 |
Volume Impedance | Ω·cm | ≥1.0×1012 | ASTM D257 |
Continuous Use Temp | ℃ | -40~150 | -- |
Thermal Conductivity | W/m·K | 1.5/3.0 | ASTM D5470 |
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